Wave soldering and reflow soldering are two common electronic product welding methods in electronic products manufacturing process.
Difference between wave soldering and reflow soldering:
Reflow process is achieved by re melting the pre paste to the printed board pad on the paste soft solder, to achieve surface assembly components, welding ends or between the pin and printed board pad, mechanical and electrical connections soldering.
With the increasing awareness of environmental protection, wave soldering has a new welding process. Tin lead alloy was used before, but lead is heavy metal, which does great harm to human body. So now there's the lead free process. It uses a * * tin silver copper alloy and special welding flux and temperature requirements and high preheating temperature also said in a PCB plate welding area to set up a workstation cooling area. This is to prevent thermal shock on the other hand, if has ICT will have an influence on the detection.
The basic wave soldering can be in solution, it is slightly larger for a relatively small component solder reflow, he is different from that in this, and reflow heating on board and its components, is actually the original brush up the solder paste to the liquefaction, in order to achieve the purpose of connecting components and boards.
1 、 reflow through preheating zone, reflow zone, cooling zone. In addition, suitable for hand soldering point inserting plate and sheet, and require all elements to heat, wave crest surface can not have used SMT solder paste components, SMT paste board can only after reflow, wave soldering can not be used.
2, wave soldering is through the tin groove will be dissolved into liquid tin, stir with the motor to form a wave crest, so that PCB and parts of welding together, generally used in hand plug-in welding and SMT glue board. Reflow soldering is mainly used in the SMT industry. It is heated by hot air or other heat radiation to melt solder paste printed on PCB and soldered to the parts.
3, the process is different: wave soldering should first spray soldering flux, and then preheat, welding, cooling zone.
The difference between wave soldering and reflow: Two: wave soldering is mainly used for welding plug-in; reflow soldering, main welding chip components
1. wave soldering is the use of tin bath to dissolve the tin into liquid, the use of motor agitation to form a wave crest, so that PCB and parts of welding together, generally used in hand plug-in welding and SMT glue board. Reflow is mainly used in the SMT industry, which is heated by hot air or other heat radiation to melt solder paste printed on PCB and soldered to the parts.
2., process is different: wave soldering should first spray soldering flux, and then preheat, welding, cooling zone. The reflow process passes through the preheating zone, the recirculation zone, and the cooling zone. In addition, suitable for hand soldering point inserting plate and sheet, and require all elements to heat, wave crest surface can not have used SMT solder paste components, SMT paste board can only after reflow, wave soldering can not be used.